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IC Snap Cure Oven SC-904-XP

IC Snap Cure Oven SC-904-XP

Feature

  1. Fully automatic curing system for fast-cure glue.
  2. Easy to connect with kinds of Die-Bonder machine.
  3. Sutable for different type of packaging without change kits.
  4. Dual language(Chinese/English) operation interface and Windows based om MMI, easy to operation.

Application

  1. Die-Bonding and curing process in-line purpose.
  2. Die-Bonding process of package Stacking Dies
  3. Pre-Heating/Pre-Heating of Flip-Chip Under-Fill process.

Specifications

Substrate

120~260(W)x 45~90(D)mm

Throughput

720 ea/hour (Curing Time 3sec + Index Time)

Heating

PID Control Curing Stations

Transfer

Wire / Strip Indexer

Magazine

Max. 270(W)x 90(D)x 160(H)mm

Facilities

220 VAC / 1 Phase/60Hz, Air: 5kg/cm2(min.)

Dimensions

Ref. 1130(W) x 1270(D) x 1640(H) mm

Weight

Approx. 650kg

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